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                Current Location:HomePage> Product Center

                Advanced materials for semiconductor

                Hengkun is dedicated to provide high-performance photoresist, special electronic gases and other advanced electronic chemical materials for semiconductor and IC companies. Hengkun’s professional team is able to provide customers with nearby service and customized product development.
                • Photoresist
                  Photoresist
                  The applications of photoresist include integrated circuit (IC), semiconductor discrete devices, liquid crystal display (LCD), touch plate, advanced packaging, LED, MEMS and so on. According to the function of the product, Hengkun's lithography-related products include non-photosensitive photoresist, photosensitive photoresist, polyimide, thinner, rinse and so on.
                  • Main sorts
                    • Arf photo resist
                    • Krf photo resist
                    • I-line photo resist
                    • Arf BARC
                    • Krf BARC
                    • SOC
                    • Si-BARC
                    • NTD Rinse
                    • PTD Rinse
                    • Thinner
                    • Developer
                • Special Gas
                  Special Gas
                  The special gases in semiconductor manufacturing mainly include various kinds of doping gases, epitaxial gases, ion implantation gases, etch gases and other inert gases widely used in various process equipments.
                  • Main sorts
                    • CxFx
                    • NF3
                    • WF6
                    • SixHx
                    • CHxFx
                    • CLF3
                    • SF6
                • Precursor
                  Precursor
                  Precursor is the main raw material of semiconductor thin film deposition process. It is widely used in semiconductor manufacturing process. It is a kind of substance that carries a target element, presents in a gaseous or volatile liquid state, has chemical thermal stability as well as corresponding reactivity or physical properties.The Company's precursor products can be used for PVD, CVD and ALD at the front or back end to form various thin film layers that meet semiconductor manufacturing requirements.  
                • Bulk Chemical
                  Bulk Chemical
                  Bulk chemicals, also known as generic chemicals, are fine chemical materials for the production of semiconductor components. They are characterized by many varieties, high quality, small dosage and demanding purity. The cost of it only accounts for about 10%-20% of the cost of the terminal products, but is crucial to the performance of electronic products.
                • Slurry
                  Slurry
                  Grinding is an important process in semiconductor processing in which semiconductor surfaces are precisely and efficiently processed by way of slurry mixed with abrasive. The slurry is an important factor affecting the quality of semiconductor surfaces.

                Materials for intelligent terminal products

                Hengkun provides material solution for the developing and manufacturing of consumer electronics, smart terminal products and optoelectronic products, including optical film material, thermal material (used for thermal conduction, thermal dissipation and thermal insulation), EMI material (used for electric conduction, shielding and insulation), adhesive buffer material and others.
                • Materials for optical film
                  Materials for optical film
                  Thermal materials and products include: thermal silica gel pads, graphite sheets, carbon nanocomposite copper foils, heat insulation sheets, etc., which are mainly used in electronic devices such as IC chips or other heat-generating components in electrical products, providing functions such heat conduction, heat dissipation, insulation, supplementary insulation or electromagnetic shielding.
                • Thermal materials
                  Thermal materials
                  Thermal materials and products include: thermal silica gel pads, graphite sheets, carbon nanocomposite copper foils, heat insulation sheets, etc., which are mainly used in electronic devices such as IC chips or other heat-generating components in electrical products, providing functions such heat conduction, heat dissipation, insulation, supplementary insulation or electromagnetic shielding.
                • EMI materials
                  EMI materials
                  EMI materials and products include conductive foam, conductive cloth tape, copper foil aluminum foil tape (double or single guide), absorber, insulated PC, etc. They are used in electrical and electronic products with functions such as electric conduction, electromagnetic shielding, electromagnetic absorption, electrical insulation, etc.
                • Adhesive buffer materials
                  Adhesive buffer materials
                  Adhesive buffer materials and products include foam products, rubber products, foam tape, PI tape, drawing tape, etc. They are used in electrical and electronic products with functions such as fixing, buffering, waterproof, dustproof, temperature protection, etc.

                Materials for new energy vehicle

                Adapting to the company’s developing needs as well as national new energy vehicle strategic planning, Hengkun will be gradually introducing various cost-effective materials to be used in power battery and vehicle decoration.
                • Battery Anode-material
                  Battery Anode-material
                • CNT
                  CNT
                • Materials for automobile interiors
                  Materials for automobile interiors
                  Materials for automobile interiors and products include: PP foam ceiling material, TPO trim-material, PP foam composite trim-material, and 3D embossed decorative film.